Opportunity Description
**Job Details:**
**Job Description:**
Intel is seeking a **Substrate Packaging Research and Development Engineer** to join our Packaging Technology Development organization. In this role, you will develop innovative assembly processes and equipment solutions that enable Intel’s future packaging technology roadmap. You will be responsible for driving process development, equipment optimization, package reliability, and manufacturing excellence for advanced package assembly technologies.
The successful candidate will leverage engineering fundamentals, experimental design, statistical analysis, and problem-solving skills to develop and qualify new packaging solutions while ensuring quality, reliability, manufacturability, and cost competitiveness.
Develops assembly processes and/or equipment and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies. Optimizes and improves the effic...
**Job Description:**
Intel is seeking a **Substrate Packaging Research and Development Engineer** to join our Packaging Technology Development organization. In this role, you will develop innovative assembly processes and equipment solutions that enable Intel’s future packaging technology roadmap. You will be responsible for driving process development, equipment optimization, package reliability, and manufacturing excellence for advanced package assembly technologies.
The successful candidate will leverage engineering fundamentals, experimental design, statistical analysis, and problem-solving skills to develop and qualify new packaging solutions while ensuring quality, reliability, manufacturability, and cost competitiveness.
Develops assembly processes and/or equipment and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies. Optimizes and improves the effic...
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