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Job Description:
JD:
Responsible for working with Broadcom's IC substrate subcontractors to manage and resolve issues relating to packaging, manufacturing, yield, quality, and delivery of high volume semiconductor devices.Responsible for NPI activity, risk assessments, process improvement & development and production engineering support of high volume IC substrate manufacturing.Work with Broadcom internal cross functional engineering teams resolve issues with interactive nature; work on newly developed packaging technology and drive towards high volume manufacturing maturityResponsible for new product pre-production engineering activity and drive improve...