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Packaging Module Equipment Development Engineer

Intel

Phoenix, AZ, United States Full-time June 22, 2026

Opportunity Description

**Job Details:**

**Job Description:**

+ Develops assembly processes and/or equipment and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies.
+ Optimizes and improves the efficiency of manufacturing of packages, developing processes to meet quality, reliability, cost, yield, productivity and manufacturability requirements.
+ Develops process and equipment specifications applying principles for design of experiments and data analysis, and documents improvements through white papers.
+ Develops and maintains equipment to evaluate silicon and package technologies under simulated field use conditions, such as heat, humidity, temperature cycle, and dynamic forces.
+ Ensures manufacturability of physical layout of package design and oversees the cycle of manufactured package processes, procedures and flows.
+ Establishes material specifications for contract assemblers and raw material ve...
Full-time other-general

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