Opportunity Description
About the Role
Design and develop advanced packaging solutions for photonic devices and optical components powering next‑generation communication systems and HPC. Define architectures, optimize thermal/mechanical performance, and ensure reliability.
Responsibilities
- Design/implement optomechanical packages; create drawings/specs/test plans.
- Analyze process flows; perform thermal/mechanical tests; drive reliability/failure analysis.
Qualifications
- Bachelor’s/Master’s in ME/Materials/Optical Eng.; experience in optical/photonics packaging; CAD (SolidWorks/AutoCAD); simulation (ANSYS/COMSOL).
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