Opportunity Description
Be part of Sanmina's Advanced Microsystems Technologies as a Microelectronic Packaging Design Engineer. Work on cutting-edge projects that influence emerging markets and technology applications.
As a crucial member of the Global Design Engineering Team, you will guide the design and engineering of microelectronic packages for diverse applications, including RF and optical technologies. Your work will encompass design from concept through prototyping to manufacturing, ensuring compliance and reliability.
Key Responsibilities:
• Define and select microelectronic design concepts
• Integrate reliability and electrical engineering into packages
• Produce design specifications and engineering documentation
• Coordinate with manufacturing for component delivery
• Perform product verification and compliance checks
Requirements:
• Bachelor’s degree in Mechanical Engineering or related field
• 8+ years in electronic hardware design and packaging
• Proficiency in ...
As a crucial member of the Global Design Engineering Team, you will guide the design and engineering of microelectronic packages for diverse applications, including RF and optical technologies. Your work will encompass design from concept through prototyping to manufacturing, ensuring compliance and reliability.
Key Responsibilities:
• Define and select microelectronic design concepts
• Integrate reliability and electrical engineering into packages
• Produce design specifications and engineering documentation
• Coordinate with manufacturing for component delivery
• Perform product verification and compliance checks
Requirements:
• Bachelor’s degree in Mechanical Engineering or related field
• 8+ years in electronic hardware design and packaging
• Proficiency in ...
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