Opportunity Description
**岗位职责：**
1. 负责半导体封装成品、半成品可靠性测试方案制定、实验执行与报告输出；
2. 开展HAST、TC、HTOL、MSL、回流焊、高低温冲击、湿热老化等封装可靠性实验；
3. 完成产品失效分析、可靠性风险评估，定位封装制程导致的产品失效根因；
4. 制定产品可靠性标准、管控规范，对接客户完成第三方可靠性审核；
5. 针对可靠性不良推动工艺、设备、设计部门完成闭环整改，沉淀可靠性数据库；
6. 熟悉AEC-Q100/JEDEC半导体行业可靠性标准。
**Why TI?**
+ Engineer your future. We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics.
+ We're different by design. Diverse backgrounds and perspectives are what push innovation forward and what make TI stronger. We value each and every voice, and look forward to hearing yours. Meet the people of TI (https://edbz.fa.us2.oraclecloud.com/hcmUI/CandidateExperience/en/sites/CX/pages/4012)
+ Benefits that benefit you. We offer competitive pay and benefits designed to help you and your family live your best life. Your well-being is important to us. Please find our country-specific benefits here (https://car...
1. 负责半导体封装成品、半成品可靠性测试方案制定、实验执行与报告输出；
2. 开展HAST、TC、HTOL、MSL、回流焊、高低温冲击、湿热老化等封装可靠性实验；
3. 完成产品失效分析、可靠性风险评估，定位封装制程导致的产品失效根因；
4. 制定产品可靠性标准、管控规范，对接客户完成第三方可靠性审核；
5. 针对可靠性不良推动工艺、设备、设计部门完成闭环整改，沉淀可靠性数据库；
6. 熟悉AEC-Q100/JEDEC半导体行业可靠性标准。
**Why TI?**
+ Engineer your future. We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics.
+ We're different by design. Diverse backgrounds and perspectives are what push innovation forward and what make TI stronger. We value each and every voice, and look forward to hearing yours. Meet the people of TI (https://edbz.fa.us2.oraclecloud.com/hcmUI/CandidateExperience/en/sites/CX/pages/4012)
+ Benefits that benefit you. We offer competitive pay and benefits designed to help you and your family live your best life. Your well-being is important to us. Please find our country-specific benefits here (https://car...
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